• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    The invention relates to a cooling device (1) for cooling in a housing arranged power electronic components, with a heat sink (3) arranged on a base (14) cooling fins (16, 17) and a fan (2) for sucking in ambient air and conveying the Ambient air over the cooling fins (16, 17) of the heat sink (3) and an inverter housing (24) with such a cooling device (1). To improve the cooling effect with optimal space conditions, the heat sink (3) has a recess (13), in which the fan (2) spaced from the base surface (14) of the heat sink (3) is arranged so that between the fan (2) and base (14) of the heat sink (3) an intermediate space (15) is formed.
    公开号:AT515828A1
    申请号:T50370/2014
    申请日:2014-05-23
    公开日:2015-12-15
    发明作者:David Scharinger；Helmut Pflügelmeier；Ronald Leitgeb；Patrick Hauser；Franz Windischbauer
    申请人:Fronius Int Gmbh；
    IPC主号:
    专利说明:

    The invention relates to a cooling device for cooling in a housing arranged power electronic components, with a heat sink with arranged on a base Kühlfin¬nen and a fan for sucking ambient air and conveying the ambient air over the cooling fins of the heat sink.
    The invention further relates to a housing for an inverter, in particular a photovoltaic inverter, with a housing front and a rear housing part. Cooling devices of the subject type with a combination of heat sink and fan are known in different variants. The purpose of such cooling devices is to efficiently dissipate the heat loss generated by power electronic components.
    The cooling device can be used in a wide variety of fields, for example for cooling the inverters of photovoltaic systems, for cooling power sources in the welding technology or for cooling battery charging systems, in which an efficient cooling is required while at the same time having as little space as possible.
    For example, DE 42 31 122 A1 describes a heat sink with fan mounted thereon. The fan sucks in the ambient air and guides it substantially perpendicularly to the cooling body. In the heat sink, the air flow is deflected by an angle of 90 degrees and passed through the cooling fins or cooling fins to the outside. It has proven to be particularly disadvantageous in this embodiment that the fan is mounted directly on the cooling body, and thus forcedly achieves a greater overall height.
    Other known cooling devices include heat sinks whose cooling fins are not arranged straight outwards but in a curved shape. Other variants include cooling fins, which are directed from the middle of the heat sink in units paral¬lel outwards. For example, US2005 / 0150637 A1 shows a cooling device with such a cooling body.
    Based on the prior art, the present invention has the object to provide a cooling device and a Wechselrich¬tergehäuse with such a cooling device, which allows an improved cooling effect with the same space-saving as possible and compact design. Disadvantages of known devices should be avoided or at least reduced.
    This object is achieved by an above-mentioned Kühlvorrich¬, in which the heat sink has a recess in which the fan is spaced from the base of the heat sink, so that between the fan and the base of the Kühl¬körpers a gap is formed. It is essential that the fan used is not mounted directly on the heat sink, but it is quasi integrated in the heat sink. For this purpose, the heat sink has a depression in which the fan is inserted at a certain minimum distance from the base surface of the heat sink becomes. As a result, optimum pressure conditions are created in terms of flow technology, which allow optimal intake of the ambient air as well as flow and deflection of the air flow and bring about optimum cooling effect. The clever integration of the fan in the cooling body and the special arrangement of the cooling fins, an efficient cooling effect is achieved at the same time low height or optimal space conditions. Due to its design, the cooling device has a wide range of application, which basically covers all technical areas in which the cooling of electronic components is necessary or desired. Due to the compact design and at the same time very good cooling properties, the application is particularly useful in many areas. In the case of known cooling devices in which the fan is mounted on the cooling body, such a cooling effect could not be achieved at the same time as optimum space ratios or low overall height.
    Advantageously, the fan is formed by an axial fan, so that the sucked ambient air in the intermediate space is deflected by an angle of preferably 90 degrees and is discharged to the outside between the cooling fins of the heat sink. By means of an axial fan optimal cooling performance can be achieved with very little space. By integrating a flat axial fan in the recess of the cooling body, it is possible to realize a high air delivery volume in conjunction with a small space requirement. In principle, however, other fans, such as radial fans or diagonal fans may be used.
    According to a feature of the invention, the fan is connected pointwise to the heat sink. As a result, the cooling air flow is not significantly hindered by the attachment points. It is also achieved by this point-wise attachment to the base that the gap is not substantially interrupted.
    The fan has a housing ring, the height of which preferably corresponds to half the total height of the fan. As a result, the cooling air flow between the lower edge of the housing ring and the base of the heat sink can be optimally passed.
    Advantageously, the housing ring is arranged on the side of the fan facing away from the base surface of the heat sink, so that a spacing is formed between the housing ring and the base area.
    On the housing ring of the fan, a radially encircling torus-shaped curvature can be provided towards the suction side.
    The fan preferably terminates flush with the top edges of the cooling fins of the heat sink or is disposed beyond the top edges of the cooling fins.
    Cooling fins with a lower height than the cooling fins arranged around the depression can likewise be provided in the recess of the cooling body. By these cooling fins below the Ro¬torblätter the fan, the cooling effect can be further increased, since already takes place under the fan in the recess very good heat dissipation. The cooling fins arranged in the depression can be arranged at specific angles and adapted to the outflow direction, so that a course of the air flow favoring the flow technique and an optimum distribution of the cooling air is made possible.
    At least the majority of the cooling fins are preferably arranged radially outward from the recess, or run out in a star shape around the recess to the outside. The cooling fins can also be mounted at least partially parallel.
    The cooling fins may have straight and / or curved course. A radial and at the same time curved shape of the cooling fins results in particular advantages, since the cooling air in the bend of the cooling fins is guided to the surface of the cooling fins, whereby an improved heat dissipation takes place over the entire length of the cooling fins.
    The object is also achieved by an above-mentioned inverter housing, wherein behind the housing front a above-described cooling device is provided, and in the front of the housing an opening for sucking in ambient air is arranged. As a result, in the case of a housing of a photovoltaic inverter frequently exposed to sunlight, optimum cooling of the power electronic components of the inverter therein is achieved and prevents the inverter housing from being heated by solar radiation.
    The opening in the housing front is preferably arranged above the fan of the cooling device.
    The invention will be explained in more detail with reference to the accompanying drawings. Show:
    1 shows an embodiment of a cooling device with a cooling body with integrated fan in an oblique view.
    2 shows a sectional view through the cooling device with integrated fan according to FIG. 1;
    3 shows a sectional view through a fan according to the invention; 4 the fan in an oblique view;
    5 shows the heat sink of the cooling device without a fan in an oblique view from above; and
    Fig. 6 is a schematic view of a housing of a Wechselrichter with integrated cooling device.
    Fig. 1 shows an embodiment of the cooling device 1 according to the invention in an oblique view. The cooling device 1 includes a combination of a heat sink 3 with integrated fan 2, in particular axial fan. The fan 2 is integrated in a recess 13 in the heat sink 3. The heat sink 3 comprises a series of cooling fins 16, 17, which are arranged substantially radially or star-shaped around the recess 13. In the illustrated embodiment, a short cooling fin 17 is arranged between each of two long cooling fins 16. This arrangement, in addition to the increase in the surface causes a division of the air flow and thus an improved cooling effect. The ventilator 2 is preferably placed at a central point of the heat sink 3 in order to achieve a uniform distribution of the intake ambient air over the entire surface of the heat sink 3.
    Fig. 2 shows the cooling device 1 according to the invention in geschnit¬tener side view. The fan 2 is preferably formed by an axial fan, but a radial fan or a diagonal fan may be used. Optimally, an axial fan is used, since this allows a particularly flat design of the entire cooling device 1. An axial fan offers a large air delivery volume while at the same time requiring little space. The fan 2 is not disposed directly on the bottom surface 14 of the heat sink 3 but is spaced therefrom. This assembly results in a gap 15 through which the air flow is passed. The creation of the intermediate space 15 is essential in order to create optimum pressure ratios between the base area 14 of the heat sink 3 and the lower edge 5 of the housing ring 4 of the fan 2. When the fan 2 is in operation, ambient air is sucked in from the upper side, sucked through the fan 2, where the cooling air impinges vertically on the base surface 14 of the heat sink 3. In a further consequence, the air flow is deflected at an angle of substantially 90 degrees and passes through the intermediate space 15hindurch to the cooling fins 16, 17 and is finally discharged laterally outward. It is essential that the air stream incident on the heat sink 3 in the frontal view is a so-called impingement air flow, which is subsequently laterally diverted by 90 degrees laterally and discharged laterally.
    In the exemplary embodiment illustrated, the fan 2 protrudes beyond the cooling fins 16, 17 or its upper edge. The cooling fins 16, 17 are not flowed through or flowed around in their uppermost area by the cooling air, which is why the cooling fins 16, 17 can also be arranged deeper than the fan 2. Finally, this also results in a certain material saving. However, the fan 2 can also be placed so deep that it is flush with the cooling fins 16, 17 or possibly even niederfü¬gig lower. The flow direction of the sucked air is indicated by arrows. The fan 2 sucks the air, then it bounces perpendicular to the base 14 of the heat sink 3 and is deflected by 90 degrees. Subsequently, the sucked air passes through the gap 15 and adjoining the cooling fins 16, 17 whereby the heat dissipation is completed.
    FIG. 3 now shows the fan 2, which is designed as an axial fan, in a sectional side view. The fan 2 has a housing ring 4, which has a circumferential recess on the underside. This recess makes it possible for the air flow drawn in from above to be able to be dissipated laterally. The rotor 9 of the fan 2 forms a unit with the housing ring 4 and the receiving plate 11. In order to mount the fan 2, requires certain mounting shots 6. If the fan 2 is mounted over its engine, a single mounting receptacle 6ausausend. Preferably, the fan 2 is fixed to the housing ring 4 with at least two attachment receivers 6. This results in the above-described gap 15 through which the air flow is guided. The height of the gap 15 is measured from the base 14 of the heat sink 3 to the lower edge 5 of the housing ring 4. This distance or this height is basically variable. This is essential insofar as only a certain height of the intermediate space 15 can create an optimum pressure ratio in order to achieve the best possible flow velocity of the cooling air. If this distance is too small, this leads to an insufficient air delivery volume being achieved. As a consequence, no sufficient cooling of the heat sink 3 can be achieved. The height between the lower edge 5 of the housing ring 4 and the Grundflä¬ surface 14 of the heat sink 3 is thus of considerable importance and demands an optimal ratio.
    The housing ring 4 of the fan 2 may have a circumferential toroidal curvature 12 on the suction side, as a result of which a streamlined suction of the ambient air without annoying edges and uniform distribution can take place. If an existing edge would form the upper end of the housing ring 4, the result would be that the air flow would be disturbed in its uniformity, which in turn leads to undesirable Ver¬wirbelungen. The toroidal curvature 12 causes a uniform inflow of the intake ambient air. Instead of the toroidal curvature 12, it is also possible, for example, to choose a cone shape or cone shape.
    From Fig. 4, the underside of the fan 2 with corresponding mounting surfaces 8 can be seen, which rest on the attachment points 7 of the heat sink 3 (see FIG. 5). It is a possible attachment variant. The points at which the fan 2 is screwed to the heat sink 3, can be fundamentally arranged at different locations. The mounting points 7 are basically placed on the heat sink 3 in such a way that they are fluidically arranged at a safe location. This is important to not significantly hinder the optimal air flow. The fastening receivers 6 of the fan 2 are connected to one another via connecting struts 10 and to a centrally arranged receiving plate 11. On the receiving plate 11 of the drive motor of the rotor 9 and the bearing for the rotor 9 of the fan 2 is held. In addition, the connecting struts 10 still increase the rigidity of the fan 2. The electrical connection to the drive motor of the fan 2 can also be arranged in one of these connecting struts 10. For example, one of the connecting struts 10 has a recess in which the electrical connection is guided (not shown).
    Finally, Fig. 5 shows the heat sink 3 with the recess 13 without fan 2 inserted. From this view, the arrangement of the cooling fins 16, 17 is also clearly visible. Basically, long cooling fins 16 and short cooling fins 17 are arranged. The short cooling fins 17 are used when the heat sink 3 has a corresponding size. According to FIG. 5, a long cooling fin 16 is followed by at least one short cooling fin 17 in each case. The number of short cooling fins 17 increases with the size of the heat sink 3. In the area of the depression 13, cooling fins can also be arranged, which represent extensions of the described cooling fins 16, 17. However, these cooling fins arranged in the recess 13 have a smaller height and can be arranged offset from one another at a certain angle. This offset relative to one another makes it possible for the sucked-in air, which flows through the fan 2, to be forwarded uniformly and in a streamlined manner to the adjoining cooling fins 16, 17. The outflow direction of the intake ambient air is adjusted so far and results in a fluidically optimal course of the air flow. The cooling fins in the region of the recess 13 cause an additional increase in the surface in this area, whereby more heat can be removed.
    The widenings 18 on the long cooling fins 16 are fundamentally conditioned by production technology, but may also have a positive effect on the flow course of the cooling air. In fact, the widenings 18 cause the air flow between these places to be directed to the cooling fins 17 in an advantageous manner, whereby improved heat dissipation can be achieved. The arrangement of the cooling fins 16, 17 is selected in the embodiment shown such that the air flow is particular to those locations flows through which most of the heat can be transported away. The widenings 18 ultimately support the distribution of the air flow into those areas through which most of the heat can be removed.
    Of course, the described arrangement of the cooling fins 16, 17 as well as the widenings 18 is only an example and may, of course, vary. Depending on the required heat transport as well as the possible space conditions, a variable arrangement of the cooling fins 16, 17 is possible. Thus, it may also be that the cooling fins 16, 17 themselves are not necessarily bent but are arranged to extend straight towards the outside. It may also be the case that instead of continuous cooling fins single
    Pins apply. This results in a corresponding enlargement of the surface of the heat sink 3. The possibilities of arrangement as well as the construction of the cooling fins are, as already mentioned, overall extensive and are therefore not further discussed at this point.
    The attachment of the fan 2 can of course be made in another way, as in Figs. 3 and Fig. 4 be¬ written. For example, the fan 2 can also be fastened by a bonding method, or the number of fastening points 7 described in FIG. 4 can be varied. Furthermore, the fan 2 does not have to be mounted directly on the heat sink 3, but parts of the fan 2 can also be mounted in an outer casing, and the fan 2 can not be placed in the recess 13 of the heat sink 3 until the outer casing is mounted.
    FIG. 6 shows an application of the cooling device 1 according to the invention in a housing 24 of an inverter, in particular a photovoltaic inverter. The shape of the cooling device 1 is adapted to the inverter. Thus, the fan 2 can also be arranged outside the center, for example, at the lower edge of the cooling body 3 of the cooling device 1. The Wechselrich¬tergehäuse 24 consists of a front part, the Gehäusefront19, and a rear housing part 20. On the housing front 19is an opening 21 arranged for the supply air, wherein the Positi¬on the opening 21 is adjusted according to the arranged behind the front panel 19 cooling device 1. In particular, the fan 2 of the cooling device 1 is arranged behind the opening 21. In the example shown, the opening 21 is arranged centrally on the housing front 19. The opening 21 may be provided with a ventilation grille, which may be necessary for safety-technical reasons and moreover prevents or reduces contamination of the fan 2 and the components behind it. Behind the heat sink 3 of the cooling device 1, a circuit board 23 is arranged with the power electronic components 22 arranged thereon and to be cooled. Thus, optimal cooling of the power electronic components 22 is achievable.
    By sucking in the cooling air from the side of the housing front 19 and a preferred lateral blowing off of the exhaust air, such inverter housing 24 can also be partially built into or integrated into a wall, whereby the space requirement can be further reduced.
    Of course, the cooling device 1 can be integrated in addition to the example mentioned here inverter, in particular photovoltaic inverter, even in other systems with Leistungselektro¬nischen components. These have been exemplarily described in the description by way of example.
    权利要求:
    Claims (13)
    [1]
    1. Cooling device (1) for cooling in a housing arranged Leistungselektronischer components, with a heat sink (3) arranged on a base (14) cooling fins (16, 17) and a fan (2) for sucking in ambient air and conveying the ambient air over the cooling fins (16, 17) of the cooling body (3), characterized in that the cooling body (3) has a recess (13), in which the fan (2) is arranged at a distance from the base surface (14) of the cooling body (3) in that a space (15) is formed between the fan (2) and base (14) of the heat sink (3).
    [2]
    2. Cooling device (1) according to claim 1, characterized in that the fan (2) is formed by an axial fan, so that the intake ambient air in the space (15) deflected by a Winkel of preferably 90 degrees and laterally between the cooling fins (16, 17) is discharged to the outside.
    [3]
    3. Cooling device (1) according to claim 1 or 2, characterized gekenn¬zeichnet that the fan (2) is connected pointwise with the cooling body (3).
    [4]
    4. Cooling device (1) according to one of claims 1 to 3, characterized in that the fan (2) has a housing ring (4) whose height preferably corresponds to half the total height of the fan (2).
    [5]
    5. Cooling device (1) according to claim 4, characterized in that the housing ring (4) on the base surface (14) of the cooling body (3) facing away from the fan (2) is arranged so that between the housing ring (4) and Base (14) is a distance formed.
    [6]
    6. Cooling device (1) according to claim 4 or 5, characterized gekenn¬zeichnet that on the housing ring (4) of the fan (2) a radially encircling torus-shaped curvature (12) is provided to the suction side.
    [7]
    7. Cooling device (1) according to any one of claims 1 to 6, characterized in that the fan (2) with the upper edges of the Kühl¬finnen (16, 17) flush terminates or beyond the upper edges of the cooling fins (16, 17) is arranged out ,
    [8]
    8. Cooling device (1) according to one of claims 1 to 7, characterized in that in the recess (13) of the cooling body (3) cooling fins with a lower height than the recess (13) arranged Kühlfinnen (16, 17) are provided ,
    [9]
    9. Cooling device (1) according to one of claims 1 to 8, characterized in that at least the majority of the cooling fins (16,17) from the recess (13) is arranged radially outwardly.
    [10]
    10. Cooling device (1) according to claim 9, characterized in that cooling fins (16, 17) have a straight course.
    [11]
    11. Cooling device (1) according to claim 9 or 10, characterized gekenn¬zeichnet that Kühlfinnen (16, 17) have curved course.
    [12]
    12. Housing (24) for an inverter, in particular photovoltaic inverter, with a front housing (19) and a rear housing part (20), characterized in that behind the housing front (19) comprises a cooling device (1) according to any one of claims 1 to 11 is provided, wherein in the housing front (19) an opening (21) is arranged for sucking in ambient air.
    [13]
    13. inverter housing (24) according to claim 12, characterized gekenn¬zeichnet that the opening (21) over the fan (2) of the Kühlvor¬richtung (1) is arranged.
    类似技术:
    公开号 | 公开日 | 专利标题
    AT515828A1|2015-12-15|Cooling device and inverter housing with such a cooling device
    EP2404110B1|2016-08-17|Lighting device with at least one heat sink
    EP2778432A1|2014-09-17|Flow rectifier
    DE102015207800A1|2016-11-03|Diagonal or centrifugal fan, guide for such a fan and system with such a fan or with several such fans
    DE10204830A1|2003-06-05|Heat dissipation system with functionally supporting fan protection
    DE102007028301A1|2007-12-13|Vehicle headlight has housing and semiconductor light source, which is arranged in housing and is thermally connected with heat sink by heat pipe
    DE202016105887U1|2016-11-09|Construction of a motor with heat dissipation function
    DE102016001965A1|2016-09-01|Air-cooled laser device with cooling fins, L-shaped heat transfer element
    EP2993358A1|2016-03-09|Ventilator with conductor plate cooling circuit
    DE102016226157A1|2018-06-28|Fan module and arrangement of one or more such fan modules in a flow channel
    DE102016001966B4|2020-06-18|Air-cooled laser device with heat transfer component having cooling fins
    DE102005050685A1|2007-05-03|Device for conveying a cooling air flow
    DE102010060261B3|2011-11-10|CPU cooler
    DE102010054592B4|2013-11-21|Cooling device for cooling components
    DE202012101922U1|2012-09-12|Cooling arrangement for a computer power supply
    DE102004028942B4|2008-04-24|Blower for an electrical device and associated modular system
    DE102014107021A1|2015-11-19|Automotive air conditioning system
    EP2971632B1|2016-12-28|Fan frame and fan module
    DE102016013736A1|2018-05-17|Water cooling microstructure cooler for an electrical or electronic component having a flow diverter and a flow distributor
    DE102016214467A1|2018-02-08|Fan unit and arrangement with at least two fan units
    DE19709193A1|1997-10-30|Radial fan housed in chamber
    DE3241860A1|1983-06-16|Radial fan
    EP2665350A2|2013-11-20|Fan unit for cooling of apparatus, such as electrical/electronic assemblies, equipment and the like
    DE102017001378A1|2018-03-01|Backward flow through microstructure cooler with integrated pump for water cooling for an electrical or electronic component
    DE202014005978U1|2014-08-11|fan
    同族专利:
    公开号 | 公开日
    US20150342091A1|2015-11-26|
    AT515828B1|2022-02-15|
    DE102015209375A1|2015-11-26|
    DE102015209375B4|2021-09-16|
    CN105101748A|2015-11-25|
    US10104808B2|2018-10-16|
    CN105101748B|2018-06-01|
    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    US4715438A|1986-06-30|1987-12-29|Unisys Corporation|Staggered radial-fin heat sink device for integrated circuit package|
    US5522700A|1995-03-03|1996-06-04|Hong; Chen Fu-In|Fan device for integrated circuit|
    US5661638A|1995-11-03|1997-08-26|Silicon Graphics, Inc.|High performance spiral heat sink|
    US5787971A|1996-03-25|1998-08-04|Dodson; Douglas A.|Multiple fan cooling device|
    US20030168202A1|2002-03-08|2003-09-11|Shyy-Woei Chang|CPU cooler|
    DE4231122C2|1992-09-17|1997-05-22|Heinrich Ing Grad Cap|Heatsink with fan|
    CN2161998Y|1993-03-26|1994-04-13|皇品工业有限公司|Radiator for integrated circuit|
    US5437327A|1994-04-18|1995-08-01|Chiou; Ming Der|CPU heat dissipating fan device|
    JP3416450B2|1997-03-21|2003-06-16|三菱電機株式会社|Power transistor module mounting structure|
    JP3352362B2|1997-07-14|2002-12-03|三菱電機株式会社|Heat sink|
    US5927385A|1998-01-21|1999-07-27|Yeh; Ming Hsin|Cooling device for the CPU of computer|
    DE19926007B4|1998-07-09|2004-08-19|Georg Fischer Rohrleitungssysteme Ag|housing unit|
    US6176299B1|1999-02-22|2001-01-23|Agilent Technologies, Inc.|Cooling apparatus for electronic devices|
    US6170563B1|1999-07-26|2001-01-09|Hsieh Hsin-Mao|Heat radiating device for notebook computer|
    JP2001177282A|1999-12-06|2001-06-29|Samsung Electro Mech Co Ltd|Cooling device of electronic component|
    CN1148628C|2000-05-10|2004-05-05|张玉媛|Heat radiator|
    US6404634B1|2000-12-06|2002-06-11|Hewlett-Packard Company|Single piece heat sink for computer chip|
    US6505680B1|2001-07-27|2003-01-14|Hewlett-Packard Company|High performance cooling device|
    CN1203747C|2001-09-26|2005-05-25|台达电子工业股份有限公司|Multiple heat radiating module set|
    US6543522B1|2001-10-31|2003-04-08|Hewlett-Packard Development Company, L.P.|Arrayed fin cooler|
    JP2003258473A|2002-02-26|2003-09-12|Yoshiyasu Sasa|Cooler having heat sink|
    TWM244719U|2003-08-27|2004-09-21|Hon Hai Prec Ind Co Ltd|Heat sink|
    TWI251460B|2004-01-09|2006-03-11|Delta Electronics Inc|Compound heat sink with multi-directional fins|
    KR101463812B1|2007-12-24|2014-11-20|엘지전자 주식회사|Fan module for refrigerator|
    CN101662918B|2008-08-27|2012-10-10|富准精密工业有限公司|Heat radiating device|
    USD604255S1|2008-10-23|2009-11-17|Abl Ip Holding Llc|Heat sink|
    US20100170657A1|2009-01-06|2010-07-08|United Technologies Corporation|Integrated blower diffuser-fin heat sink|
    CN201639903U|2009-11-30|2010-11-17|建准电机工业股份有限公司|Radiating module|
    US8295046B2|2010-07-19|2012-10-23|Hamilton Sundstrand Corporation|Non-circular radial heat sink|
    CN102355149A|2011-10-18|2012-02-15|华为技术有限公司|Inverter, sealing air flue and heat dissipation system|
    CN202840999U|2012-09-10|2013-03-27|常熟开关制造有限公司(原常熟开关厂）|Photovoltaic inverter|DE102015115750A1|2015-09-17|2017-03-23|Muhr Und Bender Kg|Belt tensioner|
    USD787455S1|2015-10-23|2017-05-23|Harman International Industries, Incorporated|Loudspeaker heat sink|
    CN105263301B|2015-11-12|2017-12-19|深圳市研派科技有限公司|A kind of liquid cooling heat radiation system and its liquid radiating row|
    DE102016102832A1|2016-02-18|2017-08-24|Rehm Gmbh & Co. Kg|Device comprising a power part comprising a power electronics and a housing surrounding this, in particular welding device, and housing for a welding device|
    GB201608523D0|2016-05-16|2016-06-29|Rolls Royce Plc|Heat sink|
    SG10201609616TA|2016-09-06|2018-04-27|Apple Inc|Electronic device with cooling fan|
    USD808929S1|2016-10-07|2018-01-30|Curtis E. Graber|Speaker|
    KR20180038659A|2016-10-07|2018-04-17|주식회사 만도|A heat sink assembly|
    JP2018155860A|2017-03-16|2018-10-04|カシオ計算機株式会社|Cooling unit, light source unit, and projection device|
    JP6984181B2|2017-06-05|2021-12-17|株式会社デンソー|Electronic device|
    JP2018206962A|2017-06-05|2018-12-27|株式会社デンソー|Electronic device|
    JP2018206958A|2017-06-05|2018-12-27|株式会社デンソー|Electronic equipment|
    JP6907723B2|2017-06-05|2021-07-21|株式会社デンソー|Electronic device|
    JP6907724B2|2017-06-05|2021-07-21|株式会社デンソー|Electronic device|
    US10285303B2|2017-07-14|2019-05-07|Apple Inc.|Electronic device with integrated passive and active cooling|
    JP6907776B2|2017-07-18|2021-07-21|株式会社デンソー|Electronic device|
    DE102018200058A1|2018-01-04|2019-07-04|Robert Bosch Gmbh|Heatsink, in particular ECU heatsink|
    JP2019149404A|2018-02-26|2019-09-05|トヨタ自動車株式会社|Heat radiation fin structure and cooling structure of electronic substrate using the same|
    DE202018103683U1|2018-06-28|2018-10-15|Ebm-Papst Mulfingen Gmbh & Co. Kg|Cooling device in modular design|
    DE102018115577A1|2018-06-28|2020-01-02|Ebm-Papst Mulfingen Gmbh & Co. Kg|Cooling device in a modular design|
    EP3708841A1|2019-03-12|2020-09-16|VITRONIC Dr.-Ing. Stein Bildverarbeitungssysteme GmbH|Device for cooling heat-radiating components|
    法律状态:
    优先权:
    申请号 | 申请日 | 专利标题
    ATA50370/2014A|AT515828B1|2014-05-23|2014-05-23|Cooling device and inverter housing with such a cooling device|ATA50370/2014A| AT515828B1|2014-05-23|2014-05-23|Cooling device and inverter housing with such a cooling device|
    DE102015209375.1A| DE102015209375B4|2014-05-23|2015-05-21|Cooling device and inverter housing with such a cooling device|
    CN201510266834.1A| CN105101748B|2014-05-23|2015-05-22|Radiator and the housing for having the inverter of this radiator|
    US14/719,536| US10104808B2|2014-05-23|2015-05-22|Heat sink and housing for an inverter with such a heat sink|
    [返回顶部]